COMPUTATIONAL HEAT TRANSFER ANALYSIS OF ELECTRONIC EQUIPMENT
Keywords:
Steady State Thermal Analysis, Finite Element Analysis (FEA), Heat Sink, Fluid Flow, Rectangular Pin Fin, Optimization, Size And Cost, Thermal Conductivity, Temperature Distribution, Heat CapacityAbstract
The Research area of engineering of the electronic system cooling is having wide application nowadays. Therefore, in the present work, Aluminum is chosen as the material for the heat sink. In the present work effect of various shapes of cross sections of fins on the mother board is studied keeping the inlet air velocity, temperature of the ambient and the heat generation constant. The optimized shape of cross section is done to analyzing the effects of velocity and inlet air temperature, keeping the other parameters constant. The results are compared and optimum operational condition of that sink is found out. The optimized shape is proceeded to find a suitable sectional area which gives a minimum temperature.
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